Invention Grant
- Patent Title: Bounding volume hierarchy box node compression
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Application No.: US17562889Application Date: 2021-12-27
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Publication No.: US11783529B2Publication Date: 2023-10-10
- Inventor: Skyler Jonathon Saleh , Chen Huang
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Volpe Koenig
- Main IPC: G06T15/06
- IPC: G06T15/06 ; G06T1/60

Abstract:
A technique for performing ray tracing operations is provided. The technique includes combining one or more common exponent values of a compressed box node with one or more minimum vertex mantissas of the compressed box node and one or more maximum vertex mantissas of the compressed box node to obtain one or more minimum vertices and one or more maximum vertices; and combining a minimum vertex of the one or more minimum vertices and a maximum vertex of the one or more maximum vertices to obtain a bounding box for a compressed box data item of the compressed box node.
Public/Granted literature
- US20230206540A1 BOUNDING VOLUME HIERARCHY BOX NODE COMPRESSION Public/Granted day:2023-06-29
Information query
IPC分类:
G | 物理 |
G06 | 计算;推算或计数 |
G06T | 一般的图像数据处理或产生 |
G06T15/00 | 3D〔三维〕图像的加工 |
G06T15/06 | .光线跟踪 |