Invention Grant
- Patent Title: Laser system and electronic device manufacturing method
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Application No.: US17192205Application Date: 2021-03-04
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Publication No.: US11804697B2Publication Date: 2023-10-31
- Inventor: Taisuke Miura , Osamu Wakabayashi
- Applicant: Gigaphoton Inc.
- Applicant Address: JP Tochigi
- Assignee: Gigaphoton Inc.
- Current Assignee: Gigaphoton Inc.
- Current Assignee Address: JP Tochigi
- Agency: Studebaker & Brackett PC
- Main IPC: H01S5/068
- IPC: H01S5/068 ; H01S3/225 ; H01S3/23 ; H01S5/40 ; H01S5/0683 ; H01S5/50

Abstract:
A laser system according to one aspect of the present disclosure includes a first solid-state laser device, a wavelength conversion system, an excimer amplifier, and a control unit. The first solid-state laser device includes a first multiple semiconductor laser system, a first semiconductor optical amplifier, and a first fiber amplifier. The first multiple semiconductor laser system includes a plurality of first semiconductor lasers configured to perform continuous wave oscillation in a single longitudinal mode with different wavelengths, a first spectrum monitor, and a first beam combiner. The control unit controls an oscillation wavelength and light intensity of each line of a first multiline spectrum generated by the first semiconductor lasers to obtain an excimer laser beam having at least a target center wavelength or a target spectral line width instructed by an external device.
Public/Granted literature
- US20210194215A1 LASER SYSTEM AND ELECTRONIC DEVICE MANUFACTURING METHOD Public/Granted day:2021-06-24
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