Invention Grant
- Patent Title: Process kit ring adaptor
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Application No.: US17216439Application Date: 2021-03-29
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Publication No.: US11842917B2Publication Date: 2023-12-12
- Inventor: Leon Volfovski , Andreas Schmid , Denis Martin Koosau , Nicholas Michael Kopec , Steven Babayan , Douglas R. McAllister , Helder Lee , Jeffrey Hudgens , Damon K. Cox
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; H01L21/683 ; H01L21/677
Abstract:
A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.
Public/Granted literature
- US20210217650A1 PROCESS KIT RING ADAPTOR Public/Granted day:2021-07-15
Information query
IPC分类:
