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    Sensor-based correction of robot-held object
    2.
    发明授权
    Sensor-based correction of robot-held object 有权

    公开(公告)号：US11626305B2

    公开(公告)日：2023-04-11

    申请号：US16452091

    申请日：2019-06-25

    Applicant: Applied Materials, Inc.

    Inventor： Nicholas Michael Kopec ,  Damon K. Cox ,  Leon Volfovski

    IPC: B25J9/16 ,  H01L21/67 ,  H01L21/677 ,  G06T1/00

    Abstract: A robotic object handling system comprises a robot arm, a non-contact sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the robot arm to position the object within a detection area of the non-contact sensor, cause the non-contact sensor to generate sensor data of the object, determine at least one of a rotational error of the object relative to a target orientation or a positional error of the object relative to a target position based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error from the object, and cause the robot arm to place the object at the first station, wherein the placed object lacks at least one of the rotational error or the positional error.

    AUTOTEACH SYSTEM
    3.
    发明申请
    AUTOTEACH SYSTEM 有权

    公开(公告)号：US20220324100A1

    公开(公告)日：2022-10-13

    申请号：US17850296

    申请日：2022-06-27

    Applicant: Applied Materials, Inc.

    Inventor： Nicholas Michael Kopec ,  Lyle Kosinski ,  Matvey Farber ,  Jeffrey Hudgens

    IPC: B25J9/16 ,  H01L21/67 ,  H01L21/00 ,  H01L21/673 ,  B25J21/00

    Abstract: An autoteach system includes an autoteach pin that is a scannable feature having a fixed position within the autoteach system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach system to the robot arm of the wafer processing system. The autoteach pin includes a first portion including a cylindrical sidewall. The robot arm is to use the first portion to locate the fixed position within the autoteach system. The autoteach portion further includes a second portion including planar sidewalls that are configured to enable calibration of robot arm error.

    PROCESS KIT ENCLOSURE SYSTEM
    4.
    发明申请
    PROCESS KIT ENCLOSURE SYSTEM 有权

    公开(公告)号：US20250087524A1

    公开(公告)日：2025-03-13

    申请号：US18958317

    申请日：2024-11-25

    Applicant: Applied Materials, Inc.

    Inventor： Helder Lee ,  Nicholas Michael Kopec ,  Leon Volfovski ,  Douglas R. McAllister ,  Andreas Schmid ,  Jeffrey Hudgens ,  Yogananda Sarode Vishwanath ,  Steven Babayan

    IPC: H01L21/687 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

    Abstract: A process kit enclosure system includes walls and a retention device structure. The retention device structure includes a retention device post and a retention device fin. The retention device fin in a first position is disposed above and secures a process kit ring supported in the interior volume of the process kit enclosure system. The retention device fin is rotated from the first position to be in a second position to be outside a boundary of the process kit ring. The retention device post is aligned with and inserts into a recess formed by a top cover of the process kit enclosure system responsive to the retention device post being in the first position. The retention device post is misaligned with and blocked from inserting into the recess formed by the top cover responsive to the retention device post of the retention device structure being in the second position.

    Process kit enclosure system
    5.
    发明授权
    Process kit enclosure system 有权

    公开(公告)号：US12165905B2

    公开(公告)日：2024-12-10

    申请号：US16417348

    申请日：2019-05-20

    Applicant: Applied Materials, Inc.

    Inventor： Helder Lee ,  Nicholas Michael Kopec ,  Leon Volfovski ,  Douglas R. McAllister ,  Andreas Schmid ,  Jeffrey Hudgens ,  Yogananda Sarode Vishwanath ,  Steven Babayan

    IPC: H01L21/687 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

    Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

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