Invention Grant
- Patent Title: Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
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Application No.: US17075130Application Date: 2020-10-20
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Publication No.: US11865518B2Publication Date: 2024-01-09
- Inventor: Tzu-Chien Wei , Yu-Hsiang Kao
- Applicant: National Tsing Hua University
- Applicant Address: TW Hsinchu
- Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee Address: TW Hsinchu
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW 6136175 2017.10.20
- Main IPC: C23C18/18
- IPC: C23C18/18 ; B01J23/44 ; B01J31/02 ; B01J35/00 ; B01J31/06 ; B01J37/02 ; B01J37/03 ; C23C18/20 ; C23C18/30 ; B01J37/04 ; B01J37/08 ; C23C18/34

Abstract:
The instant disclosure provides a method for manufacturing an electroless plating substrate and a method for forming a metal layer on a surface of a substrate. The method for preparing the electroless plating substrate includes: providing a substrate; attaching a self-adsorbed catalyst composition to a surface of the substrate; and performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate. The self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound. The colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle. The silane compound has at least one amino group to interact with the colloidal nanoparticle. A covalent bond between the silane compound and the surface of the substrate is formed through the at least one silane group of the silane compound. The colloid nanoparticle has a particle size ranging from 5 to 10 nanometers.
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Information query
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