Invention Grant
- Patent Title: Semiconductor light-emitting device
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Application No.: US18118488Application Date: 2023-03-07
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Publication No.: US11894491B2Publication Date: 2024-02-06
- Inventor: Chao-Hsing Chen , Jia-Kuen Wang , Tzu-Yao Tseng , Tsung-Hsun Chiang , Bo-Jiun Hu , Wen-Hung Chuang , Yu-Ling Lin
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW 2130742 2013.08.27 TW 2143409 2013.11.27 TW 3119845 2014.06.06 TW 3124091 2014.07.11
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/00 ; H01L33/10 ; H01L33/24 ; H01L33/42 ; H01L33/46 ; H01L33/62 ; H01L33/02 ; H01L33/08 ; H01L33/22 ; H01L33/40 ; H01L33/44

Abstract:
A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.
Public/Granted literature
- US20230238488A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE Public/Granted day:2023-07-27
Information query
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