Invention Grant
- Patent Title: Electrical device having heat dissipation structure using filler and manufacturing method of the same
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Application No.: US17398277Application Date: 2021-08-10
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Publication No.: US12028985B2Publication Date: 2024-07-02
- Inventor: Jun Kyu Lee , Jeong Man Han , Su Young Kim , Yong Woo Kang , Sang Keun Ji , Dong Kyun Ryu
- Applicant: SOLUM CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SOLUM CO., LTD.
- Current Assignee: SOLUM CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR 20200171349 2020.12.09
- Main IPC: H05K3/28
- IPC: H05K3/28 ; H05K1/02 ; H05K13/00
Abstract:
The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.
Public/Granted literature
- US20220183161A1 ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2022-06-09
Information query
