公开(公告)号：US20220173560A1

公开(公告)日：2022-06-02

申请号：US17529845

申请日：2021-11-18

Applicant: SOLUM CO., LTD.

Inventor： Young Jun Jang ,  Hyun Su Kim ,  Jun Kyu Lee ,  Pill Ju Kim ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H01R31/06 ,  H01R13/533 ,  H02J7/00

Abstract: Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case.
The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

公开(公告)号：US11783989B2

公开(公告)日：2023-10-10

申请号：US16697914

申请日：2019-11-27

Applicant: SOLUM CO., LTD. ,  ATUM CO., LTD.

Inventor： Eun Sik Kim ,  Jun Kyu Lee ,  Changyong Kwon ,  Dong-kyun Ryu ,  Sang-keun Ji ,  Taeksoo Han ,  Jung Soo Lee

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/30 ,  H01F27/32 ,  H01F27/24

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F27/306 ,  H01F27/32 ,  H01F27/24 ,  H01F2027/2809

Abstract: A transformer includes: an upper primary substrate (110) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns; a lower secondary substrate (120) which is formed by stacking a plurality of dielectric substrates, each substrate being provided with spiral conductive patterns, in which the lower secondary substrate is positioned below the upper primary substrate (110) in such a way that the lower secondary substrate comes into contact with the upper primary substrate (110) or is spaced apart from the upper primary substrate (110); and a secondary coil element (200) of a planar shape to produce an induced current by a current applied to the upper primary substrate (110) and the lower primary substrate (120).

公开(公告)号：US20220183145A1

公开(公告)日：2022-06-09

申请号：US17500654

申请日：2021-10-13

Applicant: SOLUM CO., LTD.

Inventor： Jun Kyu Lee ,  Jeong Man Han ,  Su Young Kim ,  Yong Woo Kang ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H05K1/02 ,  H05K3/34

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.

公开(公告)号：US11825599B2

公开(公告)日：2023-11-21

申请号：US17500654

申请日：2021-10-13

Applicant: SOLUM CO., LTD.

Inventor： Jun Kyu Lee ,  Jeong Man Han ,  Su Young Kim ,  Yong Woo Kang ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/16 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K5/02 ,  H05K7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/04 ,  H01L23/053 ,  H01L23/055 ,  H01L23/18 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01M10/42

CPC classification number: H05K1/0272 ,  H05K3/34 ,  H05K2201/09063

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.

公开(公告)号：US11955755B2

公开(公告)日：2024-04-09

申请号：US17529883

申请日：2021-11-18

Applicant: SOLUM CO., LTD.

Inventor： Young Jun Jang ,  Hyun Su Kim ,  Jun Kyu Lee ,  Pill Ju Kim ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H01R13/533 ,  H01R31/06 ,  H02J7/00

CPC classification number: H01R31/065 ,  H01R13/533 ,  H02J7/0045

Abstract: Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case.
The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

公开(公告)号：US20220183161A1

公开(公告)日：2022-06-09

申请号：US17398277

申请日：2021-08-10

Applicant: SOLUM CO., LTD.

Inventor： Jun Kyu Lee ,  Jeong Man Han ,  Su Young Kim ,  Yong Woo Kang ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H05K3/28 ,  H05K1/02

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

公开(公告)号：US20220173561A1

公开(公告)日：2022-06-02

申请号：US17529883

申请日：2021-11-18

Applicant: SOLUM CO., LTD.

Inventor： Young Jun Jang ,  Hyun Su Kim ,  Jun Kyu Lee ,  Pill Ju Kim ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H01R31/06 ,  H01R13/533 ,  H02J7/00

Abstract: Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case.
The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

公开(公告)号：US20240334614A1

公开(公告)日：2024-10-03

申请号：US18740398

申请日：2024-06-11

Applicant: SOLUM CO., LTD.

Inventor： Jun Kyu Lee ,  Jeong Man Han ,  Su Young Kim ,  Yong Woo Kang ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H05K3/28 ,  H05K1/02 ,  H05K13/00

CPC classification number: H05K3/284 ,  H05K1/0203 ,  H05K13/00 ,  H05K2201/0212 ,  H05K2203/1316

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.

公开(公告)号：US12028985B2

公开(公告)日：2024-07-02

申请号：US17398277

申请日：2021-08-10

Applicant: SOLUM CO., LTD.

Inventor： Jun Kyu Lee ,  Jeong Man Han ,  Su Young Kim ,  Yong Woo Kang ,  Sang Keun Ji ,  Dong Kyun Ryu

IPC: H05K3/28 ,  H05K1/02 ,  H05K13/00

CPC classification number: H05K3/284 ,  H05K1/0203 ,  H05K13/00 ,  H05K2201/0212 ,  H05K2203/1316

Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.