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Patent Agency Ranking
公开(公告)号：US20220183145A1
公开(公告)日：2022-06-09
申请号：US17500654
申请日：2021-10-13
Applicant: SOLUM CO., LTD.
Inventor： Jun Kyu Lee , Jeong Man Han , Su Young Kim , Yong Woo Kang , Sang Keun Ji , Dong Kyun Ryu
Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.
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2.发明公开公开(公告)号：US20240334614A1
公开(公告)日：2024-10-03
申请号：US18740398
申请日：2024-06-11
Applicant: SOLUM CO., LTD.
Inventor： Jun Kyu Lee , Jeong Man Han , Su Young Kim , Yong Woo Kang , Sang Keun Ji , Dong Kyun Ryu
CPC classification number: H05K3/284 , H05K1/0203 , H05K13/00 , H05K2201/0212 , H05K2203/1316
Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.
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公开(公告)号：US12028985B2
公开(公告)日：2024-07-02
申请号：US17398277
申请日：2021-08-10
Applicant: SOLUM CO., LTD.
Inventor： Jun Kyu Lee , Jeong Man Han , Su Young Kim , Yong Woo Kang , Sang Keun Ji , Dong Kyun Ryu
CPC classification number: H05K3/284 , H05K1/0203 , H05K13/00 , H05K2201/0212 , H05K2203/1316
Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.
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公开(公告)号：US20220183161A1
公开(公告)日：2022-06-09
申请号：US17398277
申请日：2021-08-10
Applicant: SOLUM CO., LTD.
Inventor： Jun Kyu Lee , Jeong Man Han , Su Young Kim , Yong Woo Kang , Sang Keun Ji , Dong Kyun Ryu
Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.
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公开(公告)号：US11825599B2
公开(公告)日：2023-11-21
申请号：US17500654
申请日：2021-10-13
Applicant: SOLUM CO., LTD.
Inventor： Jun Kyu Lee , Jeong Man Han , Su Young Kim , Yong Woo Kang , Sang Keun Ji , Dong Kyun Ryu
IPC: H05K1/02 , H05K1/09 , H05K1/16 , H05K3/28 , H05K3/30 , H05K3/34 , H05K5/02 , H05K7/00 , H01L21/56 , H01L21/60 , H01L23/00 , H01L23/04 , H01L23/053 , H01L23/055 , H01L23/18 , H01L23/31 , H01L23/48 , H01L23/498 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/58 , H01M10/42
CPC classification number: H05K1/0272 , H05K3/34 , H05K2201/09063
Abstract: The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.
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