Invention Grant
- Patent Title: Method for tilting characterization by microscopy
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Application No.: US17451498Application Date: 2021-10-20
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Publication No.: US12078791B2Publication Date: 2024-09-03
- Inventor: Jun Liu , Yu Li , Yi Li , Yingfei Wang , Shiyan Wu , Qiangmin Wei
- Applicant: Yangtze Memory Technologies Co., Ltd.
- Applicant Address: CN Hubei
- Assignee: Yangtze Memory Technologies Co., Ltd.
- Current Assignee: Yangtze Memory Technologies Co., Ltd.
- Current Assignee Address: CN Wuhan
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G02B21/36
- IPC: G02B21/36 ; G02B21/16 ; H01J37/26

Abstract:
Aspects of the disclosure provide a method of tilting characterization. The method includes measuring a first tilting shift of structures based on a first disposition of the structures. The structures are formed in a vertical direction on a horizontal plane of a product. A second tilting shift of the structures is measured based on a second disposition of the structures. The second disposition is a horizontal flip of the first disposition. A corrected tilting shift is determined based on the first tilting shift and the second tilting shift.
Public/Granted literature
- US20230073472A1 METHOD FOR TILTING CHARACTERIZATION BY MICROSCOPY Public/Granted day:2023-03-09
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