Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17613346Application Date: 2020-05-22
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Publication No.: US12100769B2Publication Date: 2024-09-24
- Inventor: Mitsuru Okigawa
- Applicant: FLOSFIA INC.
- Applicant Address: JP Kyoto
- Assignee: FLOSFIA INC.
- Current Assignee: FLOSFIA INC.
- Current Assignee Address: JP Kyoto
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 19097158 2019.05.23
- International Application: PCT/JP2020/020428 2020.05.22
- International Announcement: WO2020/235690A 2020.11.26
- Date entered country: 2021-11-22
- Main IPC: H01L29/47
- IPC: H01L29/47 ; H01L29/786 ; H01L29/872

Abstract:
An object of the disclosure is to provide a semiconductor device with low-loss and suppressed leakage current, which is particularly useful for power devices. A semiconductor device including a semiconductor layer including an oxide semiconductor having a corundum structure as a main component, and a Schottky electrode including a first electrode layer and a second electrode layer having a higher conductivity than the first electrode layer, wherein an outer edge portion of the second electrode layer is electrically connected to the semiconductor layer at an electrical connection region through the first electrode layer, and an outer edge portion of the first electrode layer is located outside an outer edge portion of the electrical connection region.
Public/Granted literature
- US20220223737A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-07-14
Information query
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