Invention Grant
- Patent Title: Semiconductor device
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Application No.: US18505348Application Date: 2023-11-09
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Publication No.: US12125943B2Publication Date: 2024-10-22
- Inventor: Huan-Yu Lai , Li-Chi Peng
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinch
- Main IPC: H01L33/14
- IPC: H01L33/14 ; H01L33/00 ; H01L33/04 ; H01L33/06 ; H01L33/30 ; H01L33/32

Abstract:
A semiconductor device is provided. The semiconductor device includes a first semiconductor layer; a second semiconductor layer on the first semiconductor layer; an active region between the second semiconductor layer and the first semiconductor layer; an electron blocking structure between the active region and the second semiconductor layer; a first nitride semiconductor layer between the active region and the electron blocking structure; and a second nitride semiconductor layer between the electron blocking structure and the second semiconductor layer. The first nitride semiconductor layer includes a first indium content, a first aluminum content and a first conductivity-type dopant. The second nitride semiconductor layer includes a second indium content, a second aluminum content and a second conductivity-type dopant. The electron blocking structure includes a first semiconductor layer including a third indium content and a third aluminum content; wherein the third indium content is greater than the second indium content.
Public/Granted literature
- US20240162380A1 SEMICONDUCTOR DEVICE Public/Granted day:2024-05-16
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