Invention Grant
- Patent Title: Manufacturing method of package structure
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Application No.: US17523919Application Date: 2021-11-11
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Publication No.: US12131917B2Publication Date: 2024-10-29
- Inventor: Yi-Hung Lin , Wen-Hsiang Liao , Cheng-Chi Wang , Yi-Chen Chou , Fuh-Tsang Wu , Ker-Yih Kao
- Applicant: Innolux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: Innolux Corporation
- Current Assignee: Innolux Corporation
- Current Assignee Address: TW Miaoli County
- Agency: JCIPRNET
- Priority: CN 2011415756.4 2020.12.07
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/02 ; H01L21/48 ; H01L23/31
Abstract:
A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.
Public/Granted literature
- US20220181167A1 MANUFACTURING METHOD OF PACKAGE STRUCTURE Public/Granted day:2022-06-09
Information query
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