Invention Grant
- Patent Title: Reduced light reflection package
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Application No.: US18371488Application Date: 2023-09-22
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Publication No.: US12133049B2Publication Date: 2024-10-29
- Inventor: Roberto Brioschi , Kazunori Hayata , Jr-Cheng Yeh , Dinesh Kumar Solanki
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Van Hoven PC
- Agent Joshua Van Hoven
- Main IPC: H04R19/04
- IPC: H04R19/04 ; B81B7/00 ; B81C1/00 ; H04R1/04 ; H04R3/00

Abstract:
A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
Public/Granted literature
- US20240015447A1 REDUCED LIGHT REFLECTION PACKAGE Public/Granted day:2024-01-11
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