-
公开(公告)号：US12133049B2
公开(公告)日：2024-10-29
申请号：US18371488
申请日：2023-09-22
Applicant: InvenSense, Inc.
Inventor： Roberto Brioschi , Kazunori Hayata , Jr-Cheng Yeh , Dinesh Kumar Solanki
CPC classification number: H04R19/04 , B81B7/0064 , B81C1/00333 , H04R1/04 , H04R3/00 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/0292 , B81B2203/0127 , B81B2207/015 , B81C2203/0109 , H04R2201/003
Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
-
公开(公告)号：US20240015447A1
公开(公告)日：2024-01-11
申请号：US18371488
申请日：2023-09-22
Applicant: InvenSense, Inc.
Inventor： Roberto Brioschi , Kazunori Hayata , Jr-Cheng Yeh , Dinesh Kumar Solanki
CPC classification number: H04R19/04 , B81B7/0064 , B81C1/00333 , H04R1/04 , H04R3/00 , B81B2201/0257 , H04R2201/003 , B81B2201/0292 , B81B2201/0271 , B81B2203/0127 , B81B2207/015 , B81C2203/0109 , B81B2201/0264
Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
-
Patent Agency Ranking
公开(公告)号：US20230087021A1
公开(公告)日：2023-03-23
申请号：US17733720
申请日：2022-04-29
Applicant: InvenSense, Inc.
Inventor： Roberto Brioschi , Vijay Wakharkar , Monisha Sharma
Abstract: Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The ceiling portion, the body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is configured to be in contact with the ceiling portion. The membrane is formed from a filtering fabric and is configured to substantially block one or more of liquids and contaminants from passing into the cavity.
-
公开(公告)号：US11760627B2
公开(公告)日：2023-09-19
申请号：US17343919
申请日：2021-06-10
Applicant: InvenSense, Inc.
Inventor： Roberto Brioschi , Benyamin Gholami Bazehhour , Milena Vujosevic , Kazunori Hayata
CPC classification number: B81B7/0048 , B81C1/00325 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/042 , B81B2207/012
Abstract: A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
-
公开(公告)号：US20220396472A1
公开(公告)日：2022-12-15
申请号：US17343919
申请日：2021-06-10
Applicant: InvenSense, Inc.
Inventor： Roberto Brioschi , Benyamin Gholami Bazehhour , Milena Vujosevic , Kazunori Hayata
Abstract: A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
-
公开(公告)号：US11800297B2
公开(公告)日：2023-10-24
申请号：US17494120
申请日：2021-10-05
Applicant: INVENSENSE, INC.
Inventor： Roberto Brioschi , Kazunori Hayata , JR-Cheng Yeh , Dinesh Kumar Solanki
CPC classification number: H04R19/04 , B81B7/0064 , B81C1/00333 , H04R1/04 , H04R3/00 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/0292 , B81B2203/0127 , B81B2207/015 , B81C2203/0109 , H04R2201/003
Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
-
公开(公告)号：US20220191624A1
公开(公告)日：2022-06-16
申请号：US17494120
申请日：2021-10-05
Applicant: INVENSENSE, INC.
Inventor： Roberto Brioschi , Kazunori Hayata , JR-Cheng Yeh , Dinesh Kumar Solanki
Abstract: A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
-
-
-
-
-
-
Search Results
7
records
(took 0.01 seconds)
