Invention Grant
- Patent Title: Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device
-
Application No.: US17438194Application Date: 2020-02-20
-
Publication No.: US12153338B2Publication Date: 2024-11-26
- Inventor: Hiroaki Shishido , Ryo Ohkubo , Osamu Nozawa
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2019-050514 20190318
- International Application: PCT/JP2020/006732 WO 20200220
- International Announcement: WO2020/189168 WO 20200924
- Main IPC: G03F1/32
- IPC: G03F1/32

Abstract:
A mask blank 100 has a structure in which a pattern-forming thin film 3 and a hard mask film 4 are formed on a transparent substrate 1 in this order. An Si2p narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of at least 103 eV. An N1s narrow spectrum obtained by analyzing the hard mask film by X-ray photoelectron spectroscopy has a maximum peak below a detection lower limit value. In the hard mask film 4, a content ratio (atomic %) of silicon and oxygen is Si:O=1:less than 2.
Public/Granted literature
- US20220214608A1 MASK BLANK, METHOD FOR MANUFACTURING TRANSFER MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2022-07-07
Information query