Invention Grant
- Patent Title: Semiconductor manufacturing apparatus, semiconductor device and manufacturing method of semiconductor device
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Application No.: US17653562Application Date: 2022-03-04
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Publication No.: US12183538B2Publication Date: 2024-12-31
- Inventor: Takayuki Ito
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2021-138315 20210826
- Main IPC: H01J37/05
- IPC: H01J37/05 ; H01J37/147 ; H01J37/20 ; H01J37/302 ; H01J37/317 ; H01L21/265 ; H01L29/78

Abstract:
A semiconductor manufacturing apparatus according to the present embodiment includes a stage on which a wafer can be placed. A separator separates a beam of impurities to be introduced into the wafer into an ion component and a neutral component. A controller switches the semiconductor manufacturing apparatus between a first mode and a second mode, where in the first mode, the ion component is introduced into the wafer and in the second mode, the neutral component is introduced into the wafer.
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