Invention Application
- Patent Title: Novel ultrasonic vibration mode for wire bonding
- Patent Title (中): 用于引线键合的新型超声波振动模式
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Application No.: US10020107Application Date: 2001-12-07
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Publication No.: US20020096554A1Publication Date: 2002-07-25
- Inventor: Tongbi Jiang , Zhiqiang Wu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: B23K001/06
- IPC: B23K001/06 ; B23K005/20 ; B23K020/10 ; B23K031/02

Abstract:
A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.
Public/Granted literature
- US06685083B2 Ultrasonic vibration mode for wire bonding Public/Granted day:2004-02-03
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