Invention Application
- Patent Title: Method for producing a cover, method for producing a packaged device
- Patent Title (中): 盖的制造方法，包装装置的制造方法
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Application No.: US10921087Application Date: 2004-08-18
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Publication No.: US20050079686A1Publication Date: 2005-04-14
- Inventor: Robert Aigner , Martin Franosch , Andreas Meckes , Klaus-Guenter Oppermann , Marc Strasser
- Applicant: Robert Aigner , Martin Franosch , Andreas Meckes , Klaus-Guenter Oppermann , Marc Strasser
- Applicant Address: DE Munchen
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munchen
- Priority: DE10206919.0 20020219
- Main IPC: H03H9/10
- IPC: H03H9/10 ; H01L21/00 ; H01L21/30 ; H01L21/48
Abstract:
In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devices may be protected easily and at low cost from external influences and particularly from a casting material for casting the entire packaged device, which results when a diced chip is cast.
Public/Granted literature
- US07288435B2 Method for producing a cover, method for producing a packaged device Public/Granted day:2007-10-30
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