Invention Application
- Patent Title: METHODS FOR BONDING AND DEVICES ACCORDING TO SUCH METHODS
- Patent Title (中): 根据这种方法联结和装置的方法
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Application No.: US11735952Application Date: 2007-04-16
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Publication No.: US20070182012A1Publication Date: 2007-08-09
- Inventor: Walter DeRaedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
- Applicant: Walter DeRaedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
- Applicant Address: BE Leuven
- Assignee: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
- Current Assignee: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
- Current Assignee Address: BE Leuven
- Priority: GBGB0414739.3 20040701; EPEP05447133.9 20050608
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.
Public/Granted literature
- US07687904B2 Plurality of devices attached by solder bumps Public/Granted day:2010-03-30
Information query
IPC分类:
