公开(公告)号：US20120092674A1

公开(公告)日：2012-04-19

申请号：US13272818

申请日：2011-10-13

Applicant: Amin Enayati ,  Steven Brebels ,  Walter De Raedt ,  Guy Vandenbosch

Inventor： Amin Enayati ,  Steven Brebels ,  Walter De Raedt ,  Guy Vandenbosch

IPC: G01N21/55 ,  G01N21/01

CPC classification number: G01N22/00

Abstract: Disclosed are methods and devices for measuring electromagnetic properties of samples. In one embodiment, a device is disclosed that includes a substantially two-dimensional measurement chamber comprising a reflective surface, where the reflective surface has a substantially elliptical shape that forms a part of an ellipse having a first focal point and a second focal point. The device further includes an input/output port located at the first focal point and a sample holder located at the second focal point.

Abstract translation: 公开了用于测量样品的电磁特性的方法和装置。 在一个实施例中，公开了一种包括基本上二维测量室的装置，其包括反射表面，其中所述反射表面具有大致椭圆形状，其形成具有第一焦点和第二焦点的椭圆的一部分。 该装置还包括位于第一焦点处的输入/输出端口和位于第二焦点处的样本保持器。

公开(公告)号：US07205177B2

公开(公告)日：2007-04-17

申请号：US11171483

申请日：2005-06-30

Applicant: Walter De Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

Inventor： Walter De Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

IPC: H01L21/48 ,  H01L23/48 ,  B23K31/02

CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3171 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27013 ,  H01L2224/2741 ,  H01L2224/29017 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/92222 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/1433 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/381 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。

公开(公告)号：US5675295A

公开(公告)日：1997-10-07

申请号：US646515

申请日：1996-05-08

Applicant: Steven Brebels ,  Kristel Fobelets ,  Philip Pieters ,  Eric Beyne ,  Gustaaf Borghs

Inventor： Steven Brebels ,  Kristel Fobelets ,  Philip Pieters ,  Eric Beyne ,  Gustaaf Borghs

IPC: H01L21/8252 ,  H01L23/522 ,  H01L27/06 ,  H01Q23/00 ,  H03B7/08 ,  H03B9/14 ,  H03B5/18

CPC classification number: H01Q23/00 ,  H01L21/8252 ,  H01L23/5222 ,  H01L27/0605 ,  H03B7/08 ,  H03B9/141 ,  H01L2223/6627 ,  H01L2224/45144 ,  H01L2224/83894 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011

Abstract: A millimeter or microwave oscillator device for a receiver or a transmitter is described. The oscillator device including a high frequency oscillating circuit including an active device 41; said active device 41 having a first and a second contact 56, 52, a signal line 49 of said oscillator device 41 being connected to said first contact 56 for connection to a load circuit 43; a biasing circuit 47 for said active device; and a low frequency oscillation suppression circuit; wherein said low frequency oscillation suppression circuit includes a decoupling capacitor 45 and one electrode of said decoupling capacitor 45 is connected to said second contact 52. A manufacturing method for the oscillator device is also disclosed.

Abstract translation: 描述了一种用于接收器或发射器的毫米波或微波振荡器装置。 所述振荡器装置包括包括有源器件41的高频振荡电路; 所述有源器件41具有第一和第二触点56,52，所述振荡器装置41的信号线49连接到所述第一触点56以连接到负载电路43; 用于所述有源器件的偏置电路47; 和低频振荡抑制电路; 其中所述低频振荡抑制电路包括去耦电容器45，并且所述去耦电容器45的一个电极连接到所述第二触点52.还公开了一种振荡器装置的制造方法。

公开(公告)号：US07687904B2

公开(公告)日：2010-03-30

申请号：US11735952

申请日：2007-04-16

Applicant: Walter De Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

Inventor： Walter De Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

IPC: H01L23/34 ,  H01L21/48 ,  B23K31/02

CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3171 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27013 ,  H01L2224/2741 ,  H01L2224/29017 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/92222 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/1433 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/381 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。

公开(公告)号：US20070182012A1

公开(公告)日：2007-08-09

申请号：US11735952

申请日：2007-04-16

Applicant: Walter DeRaedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

Inventor： Walter DeRaedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3171 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27013 ,  H01L2224/2741 ,  H01L2224/29017 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/92222 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/1433 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/381 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。

公开(公告)号：US20060012037A1

公开(公告)日：2006-01-19

申请号：US11171483

申请日：2005-06-30

Applicant: Walter Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

Inventor： Walter Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3171 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27013 ,  H01L2224/2741 ,  H01L2224/29017 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/92222 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/1433 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/381 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。