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公开(公告)号：US20130072808A1
公开(公告)日：2013-03-21
申请号：US13234773
申请日：2011-09-16
Applicant: Hercules Pereira Neves , Patrick Ruther , Stanislav Herwik , Tom Torfs
Inventor： Hercules Pereira Neves , Patrick Ruther , Stanislav Herwik , Tom Torfs
IPC: A61B5/0484 , H01R43/16
CPC classification number: A61B5/685 , A61B5/04001 , A61B5/0478 , A61B5/6868 , A61B2562/125 , Y10T29/49204
Abstract: A probe for recording and/or stimulating brain activity includes a connecting portion and at least one shank extending from the connecting portion. The at least one shank includes a first side, a second side opposed to the first side, and a fin protruding substantially perpendicularly from the second side and running on at least a part of a length of the at least one shank. The first side includes at least one recording and/or stimulating site.
Abstract translation: 用于记录和/或刺激脑活动的探针包括连接部分和从连接部分延伸的至少一个柄部。 所述至少一个柄包括第一侧，与第一侧相对的第二侧，以及从所述第二侧基本上垂直地突出并在所述至少一个柄的长度的至少一部分上延伸的翅片。 第一侧包括至少一个记录和/或刺激部位。
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Patent Agency Ranking
公开(公告)号：US20100222695A1
公开(公告)日：2010-09-02
申请号：US12667569
申请日：2008-07-07
Applicant: Tom Torfs , Chris Van Hoof , Floris Wuyts , Robby Vanspauwen
Inventor： Tom Torfs , Chris Van Hoof , Floris Wuyts , Robby Vanspauwen
IPC: A61B5/0488
CPC classification number: A61B5/0488 , A61B5/0002 , A61B5/04845 , A61B5/4023 , A61B2560/0209
Abstract: The present invention provides a Vestibular Evoked Myogenic Potential monitoring system comprising an autonomous integrated system. The integrated system comprises an output being arranged for transferring a stimulation signal via an actuator to an equilibrium organ of a person, a processing and controlling block having an integrated radio and antenna, and an array of electrodes being attachable in the vicinity of at least one muscle of said person and being arranged for recording the responsive signal and for transferring this signal to the processing and controlling block. The processing and controlling block of the integrated system is arranged for generating a stimulus, for storing and processing the recorded signals, and for sending the processed data via a WL link to a processor.
Abstract translation: 本发明提供了一种包括自主集成系统的前庭诱发肌原电位监测系统。 集成系统包括输出，其被布置成用于经由致动器将刺激信号传递到人的平衡器官，具有集成的无线电和天线的处理和控制块以及可附接到至少一个的附近的电极阵列 所述人员的肌肉并且被布置用于记录响应信号并将该信号传送到处理和控制块。 集成系统的处理和控制块被安排用于产生用于存储和处理所记录的信号的激励，以及经由WL链路将处理的数据发送到处理器。
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公开(公告)号：US07205177B2
公开(公告)日：2007-04-17
申请号：US11171483
申请日：2005-06-30
Applicant: Walter De Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
Inventor： Walter De Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
CPC classification number: H01L23/3128 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/565 , H01L23/3171 , H01L23/5225 , H01L23/5227 , H01L23/552 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2223/6677 , H01L2224/11005 , H01L2224/11334 , H01L2224/11849 , H01L2224/1191 , H01L2224/13022 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/27013 , H01L2224/2741 , H01L2224/29017 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/83051 , H01L2224/9211 , H01L2224/9212 , H01L2224/92125 , H01L2224/92222 , H01L2224/94 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/1433 , H01L2924/15331 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H01L2924/381 , H05K3/3436 , H05K2201/0379 , H05K2201/10977 , Y02P70/613 , H01L2224/81 , H01L2224/29099 , H01L2924/00 , H01L2224/0401 , H01L2924/014 , H01L2224/11 , H01L2224/27 , H01L2924/00012 , H01L2224/83 , H01L2924/0665 , H01L2224/45099
Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.
Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。
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公开(公告)号：US07687904B2
公开(公告)日：2010-03-30
申请号：US11735952
申请日：2007-04-16
Applicant: Walter De Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
Inventor： Walter De Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
CPC classification number: H01L23/3128 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/565 , H01L23/3171 , H01L23/5225 , H01L23/5227 , H01L23/552 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2223/6677 , H01L2224/11005 , H01L2224/11334 , H01L2224/11849 , H01L2224/1191 , H01L2224/13022 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/27013 , H01L2224/2741 , H01L2224/29017 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/83051 , H01L2224/9211 , H01L2224/9212 , H01L2224/92125 , H01L2224/92222 , H01L2224/94 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/1433 , H01L2924/15331 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H01L2924/381 , H05K3/3436 , H05K2201/0379 , H05K2201/10977 , Y02P70/613 , H01L2224/81 , H01L2224/29099 , H01L2924/00 , H01L2224/0401 , H01L2924/014 , H01L2224/11 , H01L2224/27 , H01L2924/00012 , H01L2224/83 , H01L2924/0665 , H01L2224/45099
Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.
Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。
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公开(公告)号：US20070182012A1
公开(公告)日：2007-08-09
申请号：US11735952
申请日：2007-04-16
Applicant: Walter DeRaedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
Inventor： Walter DeRaedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
IPC: H01L23/48
CPC classification number: H01L23/3128 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/565 , H01L23/3171 , H01L23/5225 , H01L23/5227 , H01L23/552 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2223/6677 , H01L2224/11005 , H01L2224/11334 , H01L2224/11849 , H01L2224/1191 , H01L2224/13022 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/27013 , H01L2224/2741 , H01L2224/29017 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/83051 , H01L2224/9211 , H01L2224/9212 , H01L2224/92125 , H01L2224/92222 , H01L2224/94 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/1433 , H01L2924/15331 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H01L2924/381 , H05K3/3436 , H05K2201/0379 , H05K2201/10977 , Y02P70/613 , H01L2224/81 , H01L2224/29099 , H01L2924/00 , H01L2224/0401 , H01L2924/014 , H01L2224/11 , H01L2224/27 , H01L2924/00012 , H01L2224/83 , H01L2924/0665 , H01L2224/45099
Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.
Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。
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公开(公告)号：US20060012037A1
公开(公告)日：2006-01-19
申请号：US11171483
申请日：2005-06-30
Applicant: Walter Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
Inventor： Walter Raedt , Steven Brebels , Steven Sanders , Tom Torfs , Eric Beyne
CPC classification number: H01L23/3128 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/565 , H01L23/3171 , H01L23/5225 , H01L23/5227 , H01L23/552 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2223/6677 , H01L2224/11005 , H01L2224/11334 , H01L2224/11849 , H01L2224/1191 , H01L2224/13022 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/27013 , H01L2224/2741 , H01L2224/29017 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/83051 , H01L2224/9211 , H01L2224/9212 , H01L2224/92125 , H01L2224/92222 , H01L2224/94 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/1433 , H01L2924/15331 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H01L2924/381 , H05K3/3436 , H05K2201/0379 , H05K2201/10977 , Y02P70/613 , H01L2224/81 , H01L2224/29099 , H01L2924/00 , H01L2224/0401 , H01L2924/014 , H01L2224/11 , H01L2224/27 , H01L2924/00012 , H01L2224/83 , H01L2924/0665 , H01L2224/45099
Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.
Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。
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