Invention Application
US20150096680A1 AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME
有权
用于增强膜形成的水性前体组合物及其使用方法
- Patent Title: AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME
- Patent Title (中): 用于增强膜形成的水性前体组合物及其使用方法
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Application No.: US14460476Application Date: 2014-08-15
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Publication No.: US20150096680A1Publication Date: 2015-04-09
- Inventor: Yiqiang Zhao , Dalip K. Kohli , Gaurang Kunal Shah
- Applicant: Cytec Industries Inc.
- Applicant Address: US NJ Woodland Park
- Assignee: Cytec Industries Inc.
- Current Assignee: Cytec Industries Inc.
- Current Assignee Address: US NJ Woodland Park
- Main IPC: C09J7/02
- IPC: C09J7/02 ; B32B37/12 ; B05D3/04 ; B05D3/10 ; C09D5/00 ; B05D1/02
Abstract:
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
Public/Granted literature
- US09512336B2 Aqueous primer composition for enhanced film formation and method of using the same Public/Granted day:2016-12-06
Information query
