Invention Application
US20160073508A1 METHOD FOR FORMING METAL PATTERN AND SUBSTRATE HAVING THE SAME
审中-公开
用于形成金属图案的方法和具有该金属图案的基板
- Patent Title: METHOD FOR FORMING METAL PATTERN AND SUBSTRATE HAVING THE SAME
- Patent Title (中): 用于形成金属图案的方法和具有该金属图案的基板
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Application No.: US14819432Application Date: 2015-08-06
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Publication No.: US20160073508A1Publication Date: 2016-03-10
- Inventor: Tzu-Wen Chuang , Babak Radi , Shih-Hong Chen , Jing-Wen Chen
- Applicant: Wistron NeWeb Corp.
- Priority: TW103130611 20140904
- Main IPC: H05K3/18
- IPC: H05K3/18 ; H05K1/03 ; H05K1/09
Abstract:
A method for forming a metal pattern on a substrate having at least one metal component is provided. By performing the surface passivation treatment on the at least metal component, the surface of the at least metal component becomes an anti-plating surface via an anti-plating coating. Hence, the metal pattern can be selectively formed in the following electroless plating processes.
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