Invention Application
US20160079454A1 FORMATION OF A I-III-VI2 SEMICONDUCTOR LAYER BY HEAT TREATMENT AND CHALCOGENIZATION OF AN I-III METALLIC PRECURSOR 审中-公开
通过I-III金属前体的热处理和合成形成I-III-VI2半导体层

  • Patent Title: FORMATION OF A I-III-VI2 SEMICONDUCTOR LAYER BY HEAT TREATMENT AND CHALCOGENIZATION OF AN I-III METALLIC PRECURSOR
  • Patent Title (中): 通过I-III金属前体的热处理和合成形成I-III-VI2半导体层
  • Application No.: US14888786
    Application Date: 2014-04-30
  • Publication No.: US20160079454A1
    Publication Date: 2016-03-17
  • Inventor: Cedric BroussillouSylvie Bodnar
  • Applicant: NEXCIS
  • Applicant Address: FR Rousset
  • Assignee: NEXCIS
  • Current Assignee: NEXCIS
  • Current Assignee Address: FR Rousset
  • Priority: FR1354112 20130503
  • International Application: PCT/FR2014/051030 WO 20140430
  • Main IPC: H01L31/032
  • IPC: H01L31/032 H01L21/677 F27D7/06 H01L31/036 F27B9/10 H01L31/18 H01L21/67
FORMATION OF A I-III-VI2 SEMICONDUCTOR LAYER BY HEAT TREATMENT AND CHALCOGENIZATION OF AN I-III METALLIC PRECURSOR
Abstract:
A process for forming a semiconductor layer, especially with a view to photovoltaic applications, and more particularly to a process for forming a semiconductor layer of I-III-VI2 type by heat treatment and chalcogenization of a metallic precursor of I-III type, the process comprising: a heating step under an inert atmosphere during which the temperature increases uniformly up to a first temperature of between 460° C. and 540° C., in order to enable the densification of the metallic precursor, and a chalcogenization step beginning at said first temperature and during which the temperature continues to increase up to a second temperature, a stabilization temperature, of between 550° C. and 600° C., in order to enable the formation of the semiconductor layer. The formation of a semiconductor layer, or equivalently of an absorber, having a gain in conversion efficiency of around 4%, is thus advantageously achieved.
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