Invention Application
- Patent Title: MULTILAYER PRESSURE SENSITIVE ADHESIVE ASSEMBLY
- Patent Title (中): 多层压力敏感胶粘剂组件
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Application No.: US14889289Application Date: 2014-05-12
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Publication No.: US20160096980A1Publication Date: 2016-04-07
- Inventor: Jan U. Wieneke , Frank Kuester , Zhong Chen , Jingjing Ma , Kerstin Unverhau , Doreen Eckhardt , Claudia Torre , Jonathan E. Janoski , Jayshree Seth , Arlin L. Weikel
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Priority: EP13169915.9 20130530
- International Application: PCT/US2014/037654 WO 20140512
- Main IPC: C09J7/02
- IPC: C09J7/02 ; B05D7/00 ; B32B37/26 ; B05D7/14 ; B05D3/06 ; C09J133/08 ; B05D7/04

Abstract:
The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer superimposed to a second polymer layer, wherein a curable liquid precursor of the first pressure sensitive adhesive polymer layer comprises a low Tg (meth)acrylate copolymer and a high Tg (meth)acrylate copolymer having a weight average molecular weight (Mw) of above 20,000 Daltons. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly and uses thereof.
Public/Granted literature
- US09845414B2 Multilayer pressure sensitive adhesive assembly Public/Granted day:2017-12-19
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