Invention Application
- Patent Title: Atomic Layer Deposition Head
- Patent Title (中): 原子层沉积头
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Application No.: US14957273Application Date: 2015-12-02
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Publication No.: US20160115596A1Publication Date: 2016-04-28
- Inventor: Michael J. Sershen , Ganesh M. Sundaram , Roger R. Coutu , Jill Svenja Becker , Mark J. Dalberth
- Applicant: Ultratech, Inc.
- Applicant Address: US CA San Jose
- Assignee: Ultratech, Inc.
- Current Assignee: Ultratech, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/44

Abstract:
An ALD coating method to provide a coating surface on a substrate is provided. The ALD coating method comprises: providing a deposition heading including a unit cell having a first precursor nozzle assembly and a second precursor nozzle assembly; emitting a first precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; emitting a second precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; removing moving the substrate under the deposition head such that the first precursor is directed onto a first area of the coating surface prior to the second precursor being directed onto the first area of the coating surface.
Public/Granted literature
- US09783888B2 Atomic layer deposition head Public/Granted day:2017-10-10
Information query
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