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Invention Application
US20170005021A1 EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE 有权
环氧树脂组合物，半导体密封剂和半导体器件

  • Patent Title: EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
  • Patent Title (中): 环氧树脂组合物，半导体密封剂和半导体器件
  • Application No.: US15038939
    Application Date: 2014-11-28
  • Publication No.: US20170005021A1
    Publication Date: 2017-01-05
  • Inventor: Kazuyuki KOHARA , Tomoya YAMAZAWA , Kodai OKOSHI , Nobuyuki ABE
  • Applicant: NAMICS CORPORATION
  • Priority: JP2013-247267 20131129
  • International Application: PCT/JP2014/005966 WO 20141128
  • Main IPC: H01L23/29
  • IPC: H01L23/29 ;  H01L23/00
EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
Abstract:
An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 μm or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
Abstract(Chinese):

环氧树脂组合物包括：（A）环氧树脂; （B）固化剂; （C）0.1〜10质量％的平均粒径为10nm以上且100nm以下的二氧化硅填料; 和（D）40〜75质量％的平均粒径为0.3μm以上且5μm以下的二氧化硅填料。 组分（C）和组分（D）总计含有40.1至77质量％。

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