公开(公告)号：US20170335090A1

公开(公告)日：2017-11-23

申请号：US15528739

申请日：2015-09-01

Applicant: NAMICS Corporation

Inventor： Tomoya YAMAZAWA ,  Haruyuki YOSHII

IPC: C08K9/06 ,  C08K3/22 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29

CPC classification number: C08K9/06 ,  C08K3/22 ,  C08K2003/2227 ,  C08L63/00 ,  C09J163/00 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13147 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73204 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/05432

Abstract: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).

公开(公告)号：US20170022356A1

公开(公告)日：2017-01-26

申请号：US15039231

申请日：2014-11-28

Applicant: NAMICS CORPORATION

Inventor： Tomoya YAMAZAWA ,  Kazuyuki KOHARA ,  Kodai OKOSHI ,  Nobuyuki ABE

IPC: C08L63/00 ,  C08G59/50 ,  H01L23/29 ,  C08G59/62 ,  H01L23/31 ,  C08G59/24 ,  C08G59/42

CPC classification number: C08L63/00 ,  C08G59/24 ,  C08G59/245 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/5033 ,  C08G59/621 ,  C08K3/36 ,  C08L2203/206 ,  H01L21/563 ,  H01L23/29 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3142 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83102 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/01048 ,  H01L2924/00012 ,  H01L2924/014

Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.

Abstract translation: 环氧树脂组合物包括：（A）环氧树脂; （B）固化剂; （C）0.1〜10质量％的平均粒径为10nm以上且100nm以下的二氧化硅填料; （D）47〜75质量％的平均粒径为0.3μm以上且2μm以下的二氧化硅填料; 和（E）0.1〜8质量％的弹性体，其中成分（C）和成分（D）总计含有50.1〜77质量％。

公开(公告)号：US20240132714A1

公开(公告)日：2024-04-25

申请号：US18277309

申请日：2022-06-22

Applicant: NAMICS CORPORATION

Inventor： Yuki MATSUURA ,  Ayako SATO ,  Tomoya YAMAZAWA

IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29

CPC classification number: C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  C08K2201/003

Abstract: To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.

公开(公告)号：US20170005021A1

公开(公告)日：2017-01-05

申请号：US15038939

申请日：2014-11-28

Applicant: NAMICS CORPORATION

Inventor： Kazuyuki KOHARA ,  Tomoya YAMAZAWA ,  Kodai OKOSHI ,  Nobuyuki ABE

IPC: H01L23/29 ,  H01L23/00

CPC classification number: H01L23/295 ,  C08G59/245 ,  C08G59/50 ,  C08K3/36 ,  C08K9/06 ,  C08K2201/014 ,  C08L63/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 μm or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.

Abstract translation: 环氧树脂组合物包括：（A）环氧树脂; （B）固化剂; （C）0.1〜10质量％的平均粒径为10nm以上且100nm以下的二氧化硅填料; 和（D）40〜75质量％的平均粒径为0.3μm以上且5μm以下的二氧化硅填料。 组分（C）和组分（D）总计含有40.1至77质量％。