Invention Application
- Patent Title: DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE
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Application No.: US15064437Application Date: 2016-03-08
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Publication No.: US20170238416A1Publication Date: 2017-08-17
- Inventor: JL Zhou , Pui Yin Yu
- Applicant: Multek Technologies Limited
- Applicant Address: US CA San Jose
- Assignee: Multek Technologies Limited
- Current Assignee: Multek Technologies Limited
- Current Assignee Address: US CA San Jose
- Priority: CN201610090048.5 20160217
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K1/11

Abstract:
A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.
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