公开(公告)号：US20170238416A1

公开(公告)日：2017-08-17

申请号：US15064437

申请日：2016-03-08

Applicant: Multek Technologies Limited

Inventor： JL Zhou ,  Pui Yin Yu

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K3/4691 ,  H05K2201/09781 ,  H05K2203/308

Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.

公开(公告)号：US20200015365A1

公开(公告)日：2020-01-09

申请号：US16552723

申请日：2019-08-27

Applicant: Multek Technologies Limited

Inventor： JL Zhou ,  Pui Yin Yu

IPC: H05K3/46

Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.