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    Resin flow restriction process and structure
    1.
    发明授权
    Resin flow restriction process and structure 有权

    公开(公告)号：US11317521B2

    公开(公告)日：2022-04-26

    申请号：US16946712

    申请日：2020-07-01

    Applicant: Multek Technologies Limited

    Inventor： Pui Yin Yu ,  Hong Tu Zhang ,  Xin Hua Zeng

    IPC: H05K3/46 ,  H05K1/09

    Abstract: A printed circuit board includes a first and second core. The first core has a first conductive layer, a first non-conductive layer, a first copper layer and a first opening. The first core also has a first solder mask connected to the first copper layer and a first FR4 laminate bonded to the first solder mask. The second core has a second conductive layer, a second non-conductive layer, a second copper layer and a second opening. The second core also has a second solder mask connected to the second copper layer and a second FR4 laminate bonded to the second solder mask. A prepreg layer is between the first copper layer and the second copper layer but not between the first FR4 laminate and the second FR4 laminate.

    SPLIT VIA SECOND DRILL PROCESS AND STRUCTURE
    2.
    发明申请
    SPLIT VIA SECOND DRILL PROCESS AND STRUCTURE 审中-公开

    公开(公告)号：US20170339788A1

    公开(公告)日：2017-11-23

    申请号：US15176063

    申请日：2016-06-07

    Applicant: Multek Technologies Limited

    Inventor： Znewa Zeng ,  Pui Yin Yu

    IPC: H05K1/11 ,  H05K3/40 ,  H05K3/06 ,  H05K3/46 ,  H05K1/02

    CPC classification number: H05K1/115 ,  H05K3/429 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2203/0242

    Abstract: A printed circuit board has multiple stacked layers laminated together. A through hole is formed through the laminated stack, and plating is applied to the side walls of the though hole, thereby forming a plated through hole. Second through holes are then formed through the laminated stack, where each second through hole overlaps an edge of the plated through hole. By aligning the second through holes at the edge of the plated through hole, the plating of the plated through hole coincident with each second through hole is removed, thereby separating the plated through hole into two separate circuit paths. Forming second through holes in this manner effectively splits the circuit path of the plated through hole into multiple separate circuit paths, which increases the circuit density of the printed circuit board.

    DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE
    4.
    发明申请
    DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE 审中-公开

    公开(公告)号：US20200015365A1

    公开(公告)日：2020-01-09

    申请号：US16552723

    申请日：2019-08-27

    Applicant: Multek Technologies Limited

    Inventor： JL Zhou ,  Pui Yin Yu

    IPC: H05K3/46

    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.

    DISCONNECT CAVITY BY PLATING RESIST PROCESS AND STRUCTURE
    5.
    发明申请
    DISCONNECT CAVITY BY PLATING RESIST PROCESS AND STRUCTURE 审中-公开

    公开(公告)号：US20170318685A1

    公开(公告)日：2017-11-02

    申请号：US15159665

    申请日：2016-05-19

    Applicant: Multek Technologies Limited

    Inventor： Jiawen Chen ,  Pui Yin Yu

    IPC: H05K3/42 ,  H05K3/10 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02

    CPC classification number: H05K3/429 ,  H05K1/115 ,  H05K2203/0207 ,  H05K2203/308

    Abstract: A disconnect cavity is formed within a PCB, where the disconnect cavity is electrically disconnected from a PCB landing layer. The disconnect cavity is formed using a plating resist process which does not require low flow prepreg nor selective copper etching. Plating resist is printed on a core structure selectively positioned within a PCB stack-up. The volume occupied by the plating resist forms a subsequently formed disconnect cavity. After lamination of the PCB stack-up, depth control milling, drilling and electroless copper plating are performed, followed by a plating resist stripping process to substantially remove the plating resist and all electroless copper plated to the plating resist, thereby forming the disconnect cavity. In a subsequent copper plating process, without electric connectivity copper cannot be plated to the side walls and bottom surface of the disconnect cavity, resulting in the disconnect cavity wall being electrically disconnected from the PCB landing layer.

    Dummy core restrict resin process and structure
    7.
    发明授权
    Dummy core restrict resin process and structure 有权

    公开(公告)号：US10772220B2

    公开(公告)日：2020-09-08

    申请号：US16552723

    申请日：2019-08-27

    Applicant: Multek Technologies Limited

    Inventor： J L Zhou ,  Pui Yin Yu

    IPC: H05K3/36 ,  H05K3/46

    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.

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