Invention Application
- Patent Title: PACKAGE FOR MEMS DEVICE AND PROCESS
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Application No.: US15788499Application Date: 2017-10-19
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Publication No.: US20180127265A1Publication Date: 2018-05-10
- Inventor: Roberto BRIOSCHI , David PATTEN , Rkia ACHEHBOUNE
- Applicant: Cirrus Logic International Semiconductor Ltd.
- Applicant Address: GB Edinburgh
- Assignee: Cirrus Logic International Semiconductor Ltd.
- Current Assignee: Cirrus Logic International Semiconductor Ltd.
- Current Assignee Address: GB Edinburgh
- Priority: GB1620434.9 20161201
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81B3/00
Abstract:
The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.
Public/Granted literature
- US10252906B2 Package for MEMS device and process Public/Granted day:2019-04-09
Information query
