公开(公告)号：US20200304921A1

公开(公告)日：2020-09-24

申请号：US16823588

申请日：2020-03-19

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Roberto BRIOSCHI ,  Rkia ACHEHBOUNE ,  David PATTEN

IPC: H04R19/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/04 ,  H04R7/04

Abstract: The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.

公开(公告)号：US20180279057A1

公开(公告)日：2018-09-27

申请号：US15852098

申请日：2017-12-22

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich KHENKIN ,  David PATTEN ,  Dimitris DROGOUDIS

IPC: H04R19/04 ,  H03H7/06 ,  H01L27/01 ,  B81B7/00 ,  H04R3/00 ,  H04R19/00

Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.

公开(公告)号：US20220376035A1

公开(公告)日：2022-11-24

申请号：US17741687

申请日：2022-05-11

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： David PATTEN ,  Aleksey S. KHENKIN

IPC: H01L49/02

Abstract: The disclosure relates to integrated circuits and methods of manufacture. A method involves forming a first set of one or more circuit layers on a semiconductor substrate, placing at least one prefabricated layer portion onto the first set of circuit layers to form a component, and forming a second set of one or more circuit layers over the first set of circuit layers and the at least prefabricated layer portion. The prefabricated layer portion may be a magnetic layer portion placed to form a magnetic component such as a magnetic core of an inductor or transformer. The method may also comprise forming the prefabricated layer portion.

公开(公告)号：US20210111131A1

公开(公告)日：2021-04-15

申请号：US17028707

申请日：2020-09-22

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： John PAVELKA ,  David PATTEN

IPC: H01L23/552 ,  H01L23/00

Abstract: A semiconductor device may include an integrated circuit die and a thin metal layer applied and conformed to one or more surfaces of the integrated circuit die in order to shield active circuitry of the integrated circuit die from light.

公开(公告)号：US20200369514A1

公开(公告)日：2020-11-26

申请号：US16874162

申请日：2020-05-14

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Roberto BRIOSCHI ,  Rkia ACHEHBOUNE ,  David PATTEN

IPC: B81B7/00 ,  B81B3/00 ,  H04R1/04

Abstract: The application describes a moulded interposer member for a MEMS transducer package. The interposer member comprises a void region and at least one through hole or channel.

公开(公告)号：US20190158962A1

公开(公告)日：2019-05-23

申请号：US16179237

申请日：2018-11-02

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Rkia ACHEHBOUNE ,  Dimitris DROGOUDIS ,  Roberto BRIOSCHI ,  Aleksey Sergeyevich KHENKIN ,  David PATTEN

IPC: H04R19/04 ,  B81B7/02 ,  H04R19/00 ,  H04R1/04

Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.

公开(公告)号：US20180362332A1

公开(公告)日：2018-12-20

申请号：US16007799

申请日：2018-06-13

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich KHENKIN ,  David PATTEN

IPC: B81B7/00 ,  H04R19/04

Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.

公开(公告)号：US20240128235A1

公开(公告)日：2024-04-18

申请号：US18308885

申请日：2023-04-28

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： David PATTEN

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73253

Abstract: This application describes electronic circuit packages and methods of manufacture. The package (100, 300) includes a primary integrated circuit die (101) with a smaller secondary integrated circuit die (102) attached to a first surface of the primary integrated circuit die in a first location. A first set of electrical connectors (103) extend from the first surface of the primary integrated circuit die outside the first location to a package connection layer (106) to provide electrical connection between the package connection layer and the primary integrated circuit die. An intermediate layer (108) of dielectric or insulating material extends between the primary integrated circuit die and the package connection layer so that the dielectric or insulating material surrounds the first set of electrical connectors and there is at least some dielectric or insulating material between the second integrated circuit die and the package connection layer.

公开(公告)号：US20200377363A1

公开(公告)日：2020-12-03

申请号：US16869075

申请日：2020-05-07

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Rkia ACHEHBOUNE ,  Roberto BRIOSCHI ,  Dimitris DROGOUDIS ,  David PATTEN

IPC: B81B7/00 ,  B81C1/00 ,  H04R19/04 ,  H04R31/00

Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.

公开(公告)号：US20180127265A1

公开(公告)日：2018-05-10

申请号：US15788499

申请日：2017-10-19

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Roberto BRIOSCHI ,  David PATTEN ,  Rkia ACHEHBOUNE

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B7/0032 ,  B81B3/0064 ,  B81B7/0006 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/091 ,  B81B2207/095 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2924/15151

Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.