Invention Application
- Patent Title: RETAINING RING WITH SHAPED SURFACE AND METHOD OF FORMING
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Application No.: US17590764Application Date: 2022-02-01
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Publication No.: US20220152778A1Publication Date: 2022-05-19
- Inventor: Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: B24B37/32
- IPC: B24B37/32
Abstract:
A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
Public/Granted literature
- US11577361B2 Retaining ring with shaped surface and method of forming Public/Granted day:2023-02-14
Information query
