Invention Publication
- Patent Title: METHOD OF FORMING RETAINING RING WITH SHAPED SURFACE
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Application No.: US18167007Application Date: 2023-02-09
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Publication No.: US20230182261A1Publication Date: 2023-06-15
- Inventor: Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- The original application number of the division: US17590764 2022.02.01
- Main IPC: B24B37/32
- IPC: B24B37/32
Abstract:
A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
Public/Granted literature
- US11850703B2 Method of forming retaining ring with shaped surface Public/Granted day:2023-12-26
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