A method for making a semiconductor device is provided. The method comprises: providing a package substrate strip mounted thereon multiple sets of first electronic components and multiple sets of second electronic components; forming an encapsulant layer on the package substrate strip that covers the multiple sets of first electronic components; forming a first shielding material by spray coating such that the first shielding material extends continuously from a top surface of the encapsulant layer to a top surface of the package substrate strip to cover at least a side surface of the encapsulant layer facing towards the multiple sets of second electronic components; singulating the package substrate strip into individual semiconductor packages with respective package substrates; and forming a second shielding material on the encapsulant layer by sputtering, wherein the second shielding material at least partially overlaps with the first shielding material.