公开(公告)号：US20240105638A1

公开(公告)日：2024-03-28

申请号：US18469572

申请日：2023-09-19

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  SeongHwan PARK ,  InHo SEO ,  Bom LEE

IPC: H01L23/552 ,  B23K26/38 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/552 ,  B23K26/38 ,  H01L21/565 ,  H01L23/3121 ,  B23K2101/40

Abstract: A semiconductor device comprises a substrate comprising a conductive pattern and a conductive bar on the conductive pattern; at least one electronic component on the substrate; an encapsulant layer formed on the substrate and covering the at least one electronic component, a shielding layer extending at least partially over the substrate, the substrate comprises an opening over at least a portion of the conductive bar, the portion being exposed from the encapsulant layer and the substrate, the shielding layer extending within the opening and being electrically connected with the conductive bar in the opening, wherein the opening is adjacent to the encapsulant layer or is extended by an aperture in the encapsulant layer.

公开(公告)号：US20240355643A1

公开(公告)日：2024-10-24

申请号：US18639994

申请日：2024-04-19

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： Bom LEE ,  SeongHwan PARK ,  InHo SEO ,  SeungHyun LEE

IPC: H01L21/56 ,  H01L23/552

CPC classification number: H01L21/561 ,  H01L23/552

Abstract: A method for making a semiconductor device is provided. The method comprises: providing a package substrate strip mounted thereon multiple sets of first electronic components and multiple sets of second electronic components; forming an encapsulant layer on the package substrate strip that covers the multiple sets of first electronic components; forming a first shielding material by spray coating such that the first shielding material extends continuously from a top surface of the encapsulant layer to a top surface of the package substrate strip to cover at least a side surface of the encapsulant layer facing towards the multiple sets of second electronic components; singulating the package substrate strip into individual semiconductor packages with respective package substrates; and forming a second shielding material on the encapsulant layer by sputtering, wherein the second shielding material at least partially overlaps with the first shielding material.