Invention Grant
US07156945B2 Process for forming a patterned thin film structure for in-mold decoration
失效
用于形成用于模内装饰的图案化薄膜结构的方法
- Patent Title: Process for forming a patterned thin film structure for in-mold decoration
- Patent Title (中): 用于形成用于模内装饰的图案化薄膜结构的方法
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Application No.: US10665992Application Date: 2003-09-19
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Publication No.: US07156945B2Publication Date: 2007-01-02
- Inventor: Yi-Shung Chaug , Xiaojia Wang , Sean Kiluk , Scott Tseng , Hongmei Zang , Rong-Chang Liang
- Applicant: Yi-Shung Chaug , Xiaojia Wang , Sean Kiluk , Scott Tseng , Hongmei Zang , Rong-Chang Liang
- Applicant Address: US CA Fremont
- Assignee: SiPix Imaging, Inc.
- Current Assignee: SiPix Imaging, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Howrey LLP
- Main IPC: B05D1/32
- IPC: B05D1/32 ; B05D3/10 ; B05D5/12 ; H01L21/31 ; H01L21/36 ; B32B31/10 ; B32B43/00 ; B05C11/11
Abstract:
A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.
Public/Granted literature
- US20040112237A1 Process for forming a patterned thin film structure for in-mold decoration Public/Granted day:2004-06-17
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