Invention Grant
US07649193B2 Semiconductor body and semiconductor chip comprising a semiconductor body
有权
包括半导体本体的半导体体和半导体芯片
- Patent Title: Semiconductor body and semiconductor chip comprising a semiconductor body
- Patent Title (中): 包括半导体本体的半导体体和半导体芯片
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Application No.: US11904204Application Date: 2007-09-26
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Publication No.: US07649193B2Publication Date: 2010-01-19
- Inventor: Ralph Wirth
- Applicant: Ralph Wirth
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: DE102006045700 20060927; DE102006057747 20061207
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
A semiconductor body (2), comprising a semiconductor layer sequence with an active region (3) suitable for generating radiation. The semiconductor layer sequence comprises two contact layers (6, 7), between which the active region is arranged. The contact layers are assigned a respective connection layer (12, 13) arranged on the semiconductor body. The respective connection layer is electrically conductively connected to the assigned contact layer. The respective connection layer is arranged on that side of the assigned contact layer which is remote from the active region. The connection layers are transmissive to the radiation to be generated in the active region, and the contact layers are of the same conduction type.
Public/Granted literature
- US20080073658A1 Semiconductor body and semiconductor chip comprising a semiconductor body Public/Granted day:2008-03-27
Information query
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