Invention Grant
- Patent Title: Process for making pressure sensitive adhesive tapes from cationic cure adhesives
- Patent Title (中): 从阳离子固化粘合剂制造压敏粘合带的工艺
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Application No.: US10412840Application Date: 2003-04-11
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Publication No.: US07700151B2Publication Date: 2010-04-20
- Inventor: Charles W. Paul , Peter A. Walter , Cynthia L. Meisner
- Applicant: Charles W. Paul , Peter A. Walter , Cynthia L. Meisner
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: B05D5/10
- IPC: B05D5/10 ; B05D3/10 ; C08J7/16 ; C08F2/46 ; C08F6/00 ; B05D3/06 ; C08J7/18
Abstract:
A process for the preparation of pressure sensitive adhesive tapes where cationic cure is conducted against liners and substrates with low moisture content and in an environment where moisture ingress during cure is prevented.
Public/Granted literature
- US20040202811A1 Process for making pressure sensitive adhesive tapes from cationic cure adhesives Public/Granted day:2004-10-14
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