Invention Grant
- Patent Title: Method and apparatus for forming outer electrode of electronic component
- Patent Title (中): 电子元件外电极形成方法及装置
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Application No.: US11946526Application Date: 2007-11-28
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Publication No.: US07895969B2Publication Date: 2011-03-01
- Inventor: Katsunori Ogata , Kenichi Aoki
- Applicant: Katsunori Ogata , Kenichi Aoki
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2005-199932 20050708
- Main IPC: B05C11/00
- IPC: B05C11/00 ; B05C3/00 ; B05C3/02

Abstract:
A method for forming an outer electrode capable of reducing a tact time when electrode paste is applied to end surfaces of electronic components a plurality of times. A paste tank 4 having a squeegee blade that is vertically slidable is disposed on a flat board 1 having an area being a plurality of times as large as that of a holding plate in a longitudinal direction of the flat board. A paste film is spread on the flat board by moving the flat board 1 by a length corresponding to the length of one holding plate while a predetermined gap is maintained between the squeegee blade and the flat board. The electrode paste is applied to first end surfaces of electronic components C held by the holding plate H by dipping the first end surfaces of the electronic components C in this paste film. The electrode paste is applied to the first end surfaces of the electronic components a plurality of times by repeating the spreading step and the applying step.
Public/Granted literature
- US20080131589A1 METHOD AND APPARATUS FOR FORMING OUTER ELECTRODE OF ELECTRONIC COMPONENT Public/Granted day:2008-06-05
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