Invention Grant
US08149009B2 Apparatus and method for terminating probe apparatus of semiconductor wafer
有权
用于终止半导体晶片的探针装置的装置和方法
- Patent Title: Apparatus and method for terminating probe apparatus of semiconductor wafer
- Patent Title (中): 用于终止半导体晶片的探针装置的装置和方法
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Application No.: US12820640Application Date: 2010-06-22
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Publication No.: US08149009B2Publication Date: 2012-04-03
- Inventor: Bryan J. Root , William A. Funk
- Applicant: Bryan J. Root , William A. Funk
- Applicant Address: US MN Apple Valley
- Assignee: Celadon Systems, Inc.
- Current Assignee: Celadon Systems, Inc.
- Current Assignee Address: US MN Apple Valley
- Agency: Hamre, Schuman, Mueller & Larson, P.C.
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.
Public/Granted literature
- US20100259288A1 APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER Public/Granted day:2010-10-14
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