Invention Grant
- Patent Title: Coating apparatus and method
- Patent Title (中): 涂布装置及方法
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Application No.: US12390752Application Date: 2009-02-23
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Publication No.: US08256370B2Publication Date: 2012-09-04
- Inventor: Takahiro Kitano , Koichi Obata , Hiroichi Inada , Nobuhiro Ogata
- Applicant: Takahiro Kitano , Koichi Obata , Hiroichi Inada , Nobuhiro Ogata
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-127355 20080514
- Main IPC: B05C11/02
- IPC: B05C11/02 ; B05C13/00 ; B05C13/02 ; B05C5/00 ; B05C21/00 ; B05B13/04 ; B65G53/16 ; B65G53/00 ; B65G53/26 ; B65G69/06

Abstract:
A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.
Public/Granted literature
- US20090285991A1 COATING APPARATUS AND METHOD Public/Granted day:2009-11-19
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