Invention Grant
- Patent Title: Method and apparatus for coating a thin film substrate
- Patent Title (中): 用于涂覆薄膜基材的方法和设备
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Application No.: US11846871Application Date: 2007-08-29
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Publication No.: US08383201B2Publication Date: 2013-02-26
- Inventor: Craig J. Berry , Walter Klauser , George Stephens
- Applicant: Craig J. Berry , Walter Klauser , George Stephens
- Applicant Address: US NJ Mahwah
- Assignee: Acupac Packaging, Inc.
- Current Assignee: Acupac Packaging, Inc.
- Current Assignee Address: US NJ Mahwah
- Agency: Ziegler IP Law Group, LLC
- Main IPC: B05D7/00
- IPC: B05D7/00 ; B05D1/26 ; B05D1/36

Abstract:
A method including passing a substrate by at least one slot die in at least a first direction and applying at least one coating to the substrate with the slot die, where the slot die is moved in a direction transverse to the at least first direction.
Public/Granted literature
- US20080057201A1 Method and Apparatus for Coating Webs of Material Public/Granted day:2008-03-06
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