Invention Grant
US08394457B2 Precursor composition for porous thin film, method for preparation of the precursor composition, porous thin film, method for preparation of the porous thin film, and semiconductor device 有权
多孔薄膜的前体组合物,前体组合物的制备方法,多孔薄膜,多孔薄膜的制备方法以及半导体装置

  • Patent Title: Precursor composition for porous thin film, method for preparation of the precursor composition, porous thin film, method for preparation of the porous thin film, and semiconductor device
  • Patent Title (中): 多孔薄膜的前体组合物,前体组合物的制备方法,多孔薄膜,多孔薄膜的制备方法以及半导体装置
  • Application No.: US12303240
    Application Date: 2007-05-16
  • Publication No.: US08394457B2
    Publication Date: 2013-03-12
  • Inventor: Nobutoshi FujiiTakahiro NakayamaKazuo KohmuraHirofumi Tanaka
  • Applicant: Nobutoshi FujiiTakahiro NakayamaKazuo KohmuraHirofumi Tanaka
  • Applicant Address: JP Chigasaki-shi
  • Assignee: Ulvac, Inc.
  • Current Assignee: Ulvac, Inc.
  • Current Assignee Address: JP Chigasaki-shi
  • Agency: Arent Fox LLP
  • Priority: JP2006-154846 20060602
  • International Application: PCT/JP2007/060027 WO 20070516
  • International Announcement: WO2007/142000 WO 20071213
  • Main IPC: B05D3/02
  • IPC: B05D3/02 C08J7/06 B05D3/06
Precursor composition for porous thin film, method for preparation of the precursor composition, porous thin film, method for preparation of the porous thin film, and semiconductor device
Abstract:
Disclosed is a precursor composition comprising: a compound selected from a compound represented by the formula: Si(OR1)4 and a compound represented by the formula Ra(Si)(OR2)4−a (in the formulas R1 represents a monovalent organic group; R represents a hydrogen atom, a fluorine atom or a monovalent organic group; R2 represents a monovalent organic group; and a is an integer ranging from 1 to 3, provided that R, R1 and R2 may be the same or different from one another) a thermally degradable organic compound; an element having a catalyst activity; urea; and the like. A porous thin film produced from the precursor composition is irradiated with ultraviolet ray, and then subjected to gas-phase reaction with a hydrophobic compound. A porous thin film thus prepared can be used for the manufacture of a semiconductor device.
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