Invention Grant
- Patent Title: Flexible laminate board, process for manufacturing of the board, and flexible print wiring board
- Patent Title (中): 柔性层压板,板的制造工艺和柔性印刷线路板
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Application No.: US12091519Application Date: 2006-10-19
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Publication No.: US08501279B2Publication Date: 2013-08-06
- Inventor: Masahiko Suzuki , Kazuhito Obata , Katsuyuki Masuda , Kenichi Tomioka , Masaki Takeuchi , Sumio Yoshida , Hirokazu Suzuki , Yoshitsugu Matsuura
- Applicant: Masahiko Suzuki , Kazuhito Obata , Katsuyuki Masuda , Kenichi Tomioka , Masaki Takeuchi , Sumio Yoshida , Hirokazu Suzuki , Yoshitsugu Matsuura
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2005-310184 20051025; JPP2005-353800 20051207
- International Application: PCT/JP2006/320851 WO 20061019
- International Announcement: WO2007/049502 WO 20070503
- Main IPC: B32B3/10
- IPC: B32B3/10 ; B32B15/09 ; B05D3/02 ; B05D3/10

Abstract:
A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.
Public/Granted literature
- US20090081426A1 Flexible Laminate Board, Process for Manufacturing of the Board, and Flexible Print Wiring Board Public/Granted day:2009-03-26
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