Invention Grant
- Patent Title: Evaporation apparatus and method
- Patent Title (中): 蒸发装置及方法
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Application No.: US13916852Application Date: 2013-06-13
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Publication No.: US09048373B2Publication Date: 2015-06-02
- Inventor: Chung-Hsien Wu , Chi-Yu Chiang , Shih-Wei Chen , Wen-Tsai Yen
- Applicant: TSMC Solar Ltd.
- Applicant Address: TW Taichung
- Assignee: TSMC Solar Ltd.
- Current Assignee: TSMC Solar Ltd.
- Current Assignee Address: TW Taichung
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; H01L31/18 ; H01L31/032 ; H01L21/66
Abstract:
An evaporation apparatus comprises a chamber configured to contain at least one dispensing nozzle and at least one substrate to be coated. The chamber has at least one adjustable shielding member defining an adjustable aperture. The member is positioned between the at least one dispensing nozzle and the at least one substrate. The aperture is adjustable in at least one of the group consisting of area and shape. The at least one adjustable shielding member has a heater.
Public/Granted literature
- US20140370623A1 EVAPORATION APPARATUS AND METHOD Public/Granted day:2014-12-18
Information query
IPC分类:
