Invention Grant
- Patent Title: Method and apparatus for fabricating phosphor-coated LED dies
- Patent Title (中): 制造磷光体涂层LED芯片的方法和装置
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Application No.: US14305067Application Date: 2014-06-16
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Publication No.: US09093618B2Publication Date: 2015-07-28
- Inventor: Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
- Applicant: TSMC Solid State Lighting Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TSMC SOLID STATE LIGHTING LTD.
- Current Assignee: TSMC SOLID STATE LIGHTING LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/06 ; H01L33/46 ; H01L33/54

Abstract:
The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.
Public/Granted literature
- US20140291610A1 METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES Public/Granted day:2014-10-02
Information query
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