Invention Grant
- Patent Title: Method and apparatus for fabricating phosphor-coated LED dies
- Patent Title (中): 制造磷光体涂层LED芯片的方法和装置
-
Application No.: US14294537Application Date: 2014-06-03
-
Publication No.: US09105818B2Publication Date: 2015-08-11
- Inventor: Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Ming Lin
- Applicant: TSMC Solid State Lighting Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TSMC SOLID STATE LIGHTING LTD.
- Current Assignee: TSMC SOLID STATE LIGHTING LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/06 ; H01L33/46

Abstract:
The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.
Public/Granted literature
- US20140264268A1 METHOD AND APPARATUS FOR FABRICATING PHOSPHOR-COATED LED DIES Public/Granted day:2014-09-18
Information query
IPC分类: